DocumentCode :
3269981
Title :
360/spl times/360-element very-high-frame-rate burst image sensor
Author :
Kosonocky, W.F. ; Guang Yang ; Chao Ye ; Kabra, R.K. ; Liansheng Xie ; Lawrence, J.L. ; Mastrocolla, V. ; Shallcross, F.V. ; Patel, V.
Author_Institution :
Electron. Imaging Centre, New Jersey Inst. of Technol., Newark, NJ, USA
fYear :
1996
fDate :
10-10 Feb. 1996
Firstpage :
182
Lastpage :
183
Abstract :
A 360/spl times/360-element very high frame rate (VHFR) burst image sensor captures images at maximum frame rate up to 10/sup g/ frame/s. This is accomplished by continuously storing the last 30 image frames at the pixel locations. The 360/spl times/360 VHFR imager having a 2/spl times/2 cm/sup 2/ chip is designed in the form of 4 quadrants each with 180/spl times/180 pixels. Each pixel occupies 50/spl times/50 /spl mu/m/sup 2/ and consists of a 337 /spl mu/m/sup 2/ photodetector with a fill factor of 13.5% and a S-phase 30-stage (5/spl times/6) series-parallel type buried-channel CCD (BCCD) register for continuously storing the last 30 detected image frames. The chip uses 1.5 /spl mu/m design rules and 1.5/spl times/3 /spl mu/m/sup 2/ minimum-size BCCD storage elements.
Keywords :
CCD image sensors; integrated circuit design; photodetectors; 1.5 micron; 129600 pixel; 360 pixel; burst image sensor; detected image frames; fill factor; frame rate; minimum-size BCCD storage elements; photodetector; pixel locations; series-parallel type buried-channel CCD; Charge coupled devices; Detectors; Image sensors; Image storage; Implants; Integrated optics; Optical sensors; Photodetectors; Pixel; Signal detection;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 1996. Digest of Technical Papers. 42nd ISSCC., 1996 IEEE International
Conference_Location :
San Francisco, CA, USA
ISSN :
0193-6530
Print_ISBN :
0-7803-3136-2
Type :
conf
DOI :
10.1109/ISSCC.1996.488562
Filename :
488562
Link To Document :
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