DocumentCode
3270525
Title
Helium implant depth dependence on thermal growth of nanocavities in silicon
Author
Ntsoenzok, E. ; Ashok, S. ; Regula, G. ; Pichaud, B.
Author_Institution
CNRS/CERI, Orleans, France
Volume
3
fYear
2004
fDate
18-21 Oct. 2004
Firstpage
2382
Abstract
Silicon samples were implanted with both 50 keV and 1.55 MeV 3He ions and annealed at different temperatures. The thermal growth of cavities was performed using transmission electron microscopy (TEM) measurements. Results show a significant difference in the formation and growth of cavities. Implantation of 50 keV ions to a total dose of 2.83×1016 He/cm2 results in the unexpected formation of platelets when the annealing temperature is 400°C, while a sample implanted with 1.55 MeV ions at an equivalent helium concentration (5×1016 He/cm2) gives rise to spherical cavities after the same thermal treatment.
Keywords
annealing; elemental semiconductors; helium ions; ion implantation; nanotechnology; silicon; transmission electron microscopy; voids (solid); 1.55 MeV; 400 C; 50 keV; He; Si; annealing temperature; helium implant depth dependence; helium ion implantation; platelets; silicon; thermal nanocavity growth; transmission electron microscopy; Annealing; Charge carrier lifetime; Geoscience; Helium; Implants; Impurities; Silicon; Temperature; Thermal engineering; Transmission electron microscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN
0-7803-8511-X
Type
conf
DOI
10.1109/ICSICT.2004.1435326
Filename
1435326
Link To Document