• DocumentCode
    3270525
  • Title

    Helium implant depth dependence on thermal growth of nanocavities in silicon

  • Author

    Ntsoenzok, E. ; Ashok, S. ; Regula, G. ; Pichaud, B.

  • Author_Institution
    CNRS/CERI, Orleans, France
  • Volume
    3
  • fYear
    2004
  • fDate
    18-21 Oct. 2004
  • Firstpage
    2382
  • Abstract
    Silicon samples were implanted with both 50 keV and 1.55 MeV 3He ions and annealed at different temperatures. The thermal growth of cavities was performed using transmission electron microscopy (TEM) measurements. Results show a significant difference in the formation and growth of cavities. Implantation of 50 keV ions to a total dose of 2.83×1016 He/cm2 results in the unexpected formation of platelets when the annealing temperature is 400°C, while a sample implanted with 1.55 MeV ions at an equivalent helium concentration (5×1016 He/cm2) gives rise to spherical cavities after the same thermal treatment.
  • Keywords
    annealing; elemental semiconductors; helium ions; ion implantation; nanotechnology; silicon; transmission electron microscopy; voids (solid); 1.55 MeV; 400 C; 50 keV; He; Si; annealing temperature; helium implant depth dependence; helium ion implantation; platelets; silicon; thermal nanocavity growth; transmission electron microscopy; Annealing; Charge carrier lifetime; Geoscience; Helium; Implants; Impurities; Silicon; Temperature; Thermal engineering; Transmission electron microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
  • Print_ISBN
    0-7803-8511-X
  • Type

    conf

  • DOI
    10.1109/ICSICT.2004.1435326
  • Filename
    1435326