Wafer level vertical interconnection method for microcolumn array

A concept of miniaturized and arrayed electron beam system using vertical interconnection was proposed and fabrication with interconnection using metal reflow was performed. The interconnection of electron beam array is very important because all single columns should be controlled individually to obtain a uniformity of electron beam array. In addition, the interconnection area should be reduced to make the size of a single column smaller. Therefore, a vertical interconnection method was proposed and the schematic of vertically interconnected monolithic microcolumn is shown. The other advantages of this vertical interconnection method are controllable columns and removal of interference between columns (Han, 2005).