Title :
Electrical Performance of Electronic Packaging
Abstract :
The Conference provides a forum for the presentation and discussion of the latest advances in electrical design, analysis and characterization of interconnections and packaging structures for digital, mixed signal, RF, microwave and mm-wave applications. The following topics were dealt with: system packaging trends; package design issues; microprocessor packaging design; on-chip interconnection issues; switching systems; simultaneously switching noise; measurement-based characterization; simulation; wireless communications; passive component integration; microwave packaging; radiated emissions and susceptibility; modeling
Keywords :
circuit analysis computing; circuit noise; design engineering; integrated circuit measurement; microwave circuits; millimetre wave circuits; packaging; transmission lines; RF applications; digital circuits; electrical design; electrical performance; electronic packaging; high-speed electronic systems; interconnections; measurement-based characterization; microprocessor packaging design; microwave packaging; mixed signal circuits; mm-wave applications; modeling; on-chip interconnection; package design issues; packaging structures; passive component integration; radiated emissions; simulation; simultaneously switching noise; switching systems; system packaging trends; wireless communications;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564753
