DocumentCode :
3270593
Title :
Low Ea chemical amplification resists for 193nm lithography
Author :
Ogata, Toshiyuki ; Furuya, Sanae ; Takahashi, Motoki ; Kinoshita, Yohei ; Hada, Hideo ; Shirai, Masamitsu
Author_Institution :
Tokyo Ohka Kogyo Co., Ltd., Kanagawa, Japan
fYear :
2005
fDate :
25-28 Oct. 2005
Firstpage :
114
Lastpage :
115
Abstract :
193 nm lithography including immersion lithography is drawing attention as the successor of optical lithography for the technology nodes of 65 nm, 45 nm, and possibly even beyond 32 nm (Kishimura, 2005). Therefore, there have been many researches for the base polymer and monomer materials for 193nm chemical amplification positive-tone resists. However, in the 193nm resists systems, previous reports of protecting group of carboxylic acid have been limited to alkoxy-ethyl acetal type, tertiary alkyl, tert-butoxycarbonyl, or tert-butoxycarbonylmethyl (Ito, 2005).
Keywords :
immersion lithography; nanolithography; polymers; resists; ultraviolet lithography; 193 nm; 32 nm; 45 nm; 65 nm; activation energy; base polymer; chemical amplification resists; immersion lithography; monomer materials; nanolithography; optical lithography; positive-tone resists; Chemicals; Chemistry; Infrared spectra; Lithography; Optical films; Polymers; Protection; Resists; Stimulated emission; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2005 International
Print_ISBN :
4-9902472-2-1
Type :
conf
DOI :
10.1109/IMNC.2005.203764
Filename :
1595240
Link To Document :
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