• DocumentCode
    327073
  • Title

    Repair of memory arrays by cutting

  • Author

    Park, N. ; Lombardi, F.

  • Author_Institution
    School of Mines & Technol., Rapid City, SD, USA
  • fYear
    1998
  • fDate
    24-25 Aug 1998
  • Firstpage
    124
  • Lastpage
    130
  • Abstract
    This paper presents new algorithms for yield enhancement of redundant memories. These algorithms are based on the technique of spare cutting for a redundant memory chip in which repair is implemented by row/column deletion. Different approaches are proposed: some of these approaches are based on a fully exhaustive process, while others try to heuristically reduce the computational overhead involved in determining the repair-solution of a redundant memory. Conditions for unidirectional and bidirectional cutting (i.e. cutting either along the rows and/or columns of the memory) are analyzed
  • Keywords
    VLSI; integrated circuit yield; integrated memory circuits; random-access storage; redundancy; bidirectional cutting; memory array repair; memory chip; redundant memories; row/column deletion; spare cutting; unidirectional cutting; yield enhancement algorithms; Cities and towns; Hip; Laser beam cutting; Logic arrays; Manufacturing; Production; Random access memory; Redundancy; Routing; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Memory Technology, Design and Testing, 1998. Proceedings. International Workshop on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-8186-8494-1
  • Type

    conf

  • DOI
    10.1109/MTDT.1998.705958
  • Filename
    705958