Title :
A Temperature and Reliability Oriented Simulation Framework for Multi-core Architectures
Author :
Corbetta, Simone ; Zoni, Davide ; Fornaciari, William
Author_Institution :
Dipt. di Elettron. e Inf., Politec. di Milano, Milan, Italy
Abstract :
The increasing complexity of multi-core architectures demands for a comprehensive evaluation of different solutions and alternatives at every stage of the design process, considering different aspects at the same time. Simulation frameworks are attractive tools to fulfil this requirement, due to their flexibility. Nevertheless, state-of-the-art simulation frameworks lack a joint analysis of power, performance, temperature profile and reliability projection at system-level, focusing only on a specific aspect. This paper presents a comprehensive estimation framework that jointly exploits these design metrics at system-level, considering processing cores, interconnect design and storage elements. We describe the framework in details, and provide a set of experiments that highlight its capability and flexibility, focusing on temperature and reliability analysis of multi-core architectures supported by Network-on-Chip interconnect.
Keywords :
integrated circuit interconnections; integrated circuit reliability; multiprocessing systems; multiprocessor interconnection networks; network-on-chip; comprehensive estimation framework; comprehensive evaluation; design metrics; design process; interconnect design; joint analysis; multicore architectures; network-on-chip interconnect; processing cores; reliability analysis; reliability oriented simulation framework; reliability projection; state-of-the-art simulation frameworks; storage elements; system-level; temperature oriented simulation framework; temperature profile; Computational modeling; Computer architecture; Degradation; Estimation; Microarchitecture; Reliability engineering; Multi-core; Reliability; Simulation; Thermal;
Conference_Titel :
VLSI (ISVLSI), 2012 IEEE Computer Society Annual Symposium on
Conference_Location :
Amherst, MA
Print_ISBN :
978-1-4673-2234-8
DOI :
10.1109/ISVLSI.2012.22
