A FDTD method for fast simulation of decoupling capacitors on multilayer multichip modules

Author

Huber, Andreas ; Wendel, Jan ; Reiß, Karl

Author_Institution

Inst. fur Technol. Elektrotech. und Messtech., Karlsruhe Univ., Germany

fYear

1999

fDate

1999

Firstpage

228

Lastpage

231

Abstract

We present a new method for the simulation of the power supply system on multilayer substrates of multichip modules (MCM). In particular we investigate the efficiency of extended high capacitance layers used as decoupling capacitors. The proposed method works with a lumped element FDTD technique which facilitates electromagnetic simulation of the substrate simultaneous with simulation of the mounted electronic circuit. The stratified configuration of multilayer structures allows division of the 3D problem into separate 2D problems. This yields an efficient algorithm. The algorithm has been implemented in C++ and tested with different examples. Furthermore we present reference data derived by analytical investigation of a circular plate capacitor. This data is used to evaluate the simulation results

Keywords

capacitors; circuit simulation; digital simulation; finite difference time-domain analysis; multichip modules; substrates; 3D problem; C++; FDTD method; circular plate capacitor; decoupling capacitors; decoupling capacitors simulation; electromagnetic simulation; extended high capacitance layers; lumped element FDTD technique; mounted electronic circuit; multilayer multichip modules; multilayer substrates; parallel plates; power supply system; Capacitance; Capacitors; Circuit simulation; Circuit testing; Electronic circuits; Finite difference methods; Multichip modules; Nonhomogeneous media; Power supplies; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 1999 International Symposium on

Conference_Location

Tokyo

Print_ISBN

4-9980748-4-9

Type

conf

DOI

10.1109/ELMAGC.1999.801305

Filename

801305