DocumentCode :
3271182
Title :
Packaging sciences research at the Semiconductor Research Corporation (SRC)
Author :
Bracken, R.C.
Author_Institution :
Semicond. Res. Corp., Research Triangle Park, NC
fYear :
1996
fDate :
28-30 Oct 1996
Firstpage :
3
Lastpage :
4
Abstract :
The SRC is a non-profit corporation which has as its mission improving the competitiveness of its member companies in semiconductor technology. Its charter is to fund university research focused on areas relevant to its member companies longer term, strategic needs. SRC has the dual goals of supporting graduate training of students in semiconductor technology, and the production of research results. In carrying out this mission, research is supported in the areas of lithography, process integration and devices, materials and bulk sciences, factory sciences, interconnects, IC design, and packaging. Packaging Sciences is ll% of the SRC operating budget of approximately $30M. Its mission is to support and manage research programs that develop the design of packaging for the high speed, high power, high I/O circuits used in the next 5-10 year timeframe as projected in National Technology Roadmap for Semiconductors (NTRS)
Keywords :
integrated circuit packaging; power integrated circuits; research and development management; NTRS; National Technology Roadmap for Semiconductors; Semiconductor Research Corporation; high I/O circuits; high power circuits; high-speed circuits; packaging sciences research; research programs; semiconductor technology; training;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
Type :
conf
DOI :
10.1109/EPEP.1996.564756
Filename :
564756
Link To Document :
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