• DocumentCode
    327122
  • Title

    SiC devices for power and high-temperature applications

  • Author

    Wondrak, W. ; Niemann, E. ; Held, K. ; Constapel, R. ; Kroetz, G.

  • Author_Institution
    Daimler-Benz AG, Frankfurt, Germany
  • Volume
    1
  • fYear
    1998
  • fDate
    7-10 Jul 1998
  • Firstpage
    153
  • Abstract
    Silicon carbide is a semiconductor material with superior properties compared with silicon or gallium arsenide. The main advantages concern high-temperature, high-power, high-frequency, and radiation hardened applications. In the first part of the paper, the material characteristics of SiC will be reviewed from a device point of view and the main application fields for SiC devices are summarized. In the second part, an overview of the current status of SiC devices and circuits is given. Special emphasis is put on high-temperature operation. These new devices enable advanced applications in power industry and mobile systems. Transfer to production seems to be possible within the next few years, being mainly a question of substrate quality and cost
  • Keywords
    power electronics; semiconductor materials; silicon compounds; SiC; SiC devices; high-frequency applications; high-temperature applications; material characteristics; power applications; radiation hardened applications; semiconductor material; Leakage current; MOSFETs; Power electronics; Rectifiers; Schottky barriers; Schottky diodes; Silicon carbide; Switching loss; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics, 1998. Proceedings. ISIE '98. IEEE International Symposium on
  • Conference_Location
    Pretoria
  • Print_ISBN
    0-7803-4756-0
  • Type

    conf

  • DOI
    10.1109/ISIE.1998.707767
  • Filename
    707767