DocumentCode
3271279
Title
A BiCMOS active substrate probe card technology for digital testing
Author
Zargari, M. ; Leung, J. ; Wong, S.S. ; Wooley, B.A.
Author_Institution
Center for Integrated Syst., Stanford Univ., CA, USA
fYear
1996
fDate
10-10 Feb. 1996
Firstpage
308
Lastpage
309
Abstract
An active substrate silicon probe card employs a polyimide membrane formed on a silicon substrate. The probe card combines tungsten probe tips and aluminum interconnects in the polyimide membrane with active test circuitry integrated in the silicon substrate. The card is potentially capable of providing more than 1000 probe tips in an array format. The choice of the active circuitry included in the substrate depends on the application of the probe card. If the probe card is intended for use with conventional digital testers, linear buffers can be integrated into the substrate to isolate the device under test (DUT) outputs from the 50/spl Omega/ transmission lines in the test system and drive those lines from matched impedances. Alternatively, by integrating the front-end circuits of a digital tester into the substrate, timing measurements can be made at distances less than 1cm from the probe tips, resulting in a significant improvement in testing accuracy. In this work, experimental circuits for both approaches are explored. An experimental prototype of an active substrate probe card employing linear buffers is integrated in a 2/spl mu/m BICMOS technology.
Keywords
BiCMOS integrated circuits; buffer circuits; impedance matching; integrated circuit measurement; integrated circuit testing; mixed analogue-digital integrated circuits; probes; timing; 2 micron; BiCMOS active substrate; active test circuitry; array format; device under test; digital testing; front-end circuits; linear buffers; matched impedances; polyimide membrane; probe card technology; probe tips; testing accuracy; timing measurements; Aluminum; BiCMOS integrated circuits; Biomembranes; Circuit testing; Integrated circuit technology; Polyimides; Probes; Silicon; System testing; Tungsten;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 1996. Digest of Technical Papers. 42nd ISSCC., 1996 IEEE International
Conference_Location
San Francisco, CA, USA
ISSN
0193-6530
Print_ISBN
0-7803-3136-2
Type
conf
DOI
10.1109/ISSCC.1996.488631
Filename
488631
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