Title :
SIP-Spice Intranet Package
Author :
Wilamowski, Hogdan ; Regnier, John ; Malinowski, Aleksander
Author_Institution :
Dept. of Electr. Eng., Wyoming Univ., Laramie, WY, USA
Abstract :
Computer network communications have become a popular and efficient means of computing. Most companies and research institutions use networks to some extent on a regular basis. This paper demonstrates the capability of computer-aided design (CAD) through computer networks. There are several benefits that make networked CAD tools desirable. A networked application can be used remotely through any network connection. Any operating system can be used to access a networked application, making the application operating system independent. Also the application can be made to run on a pay-per-use basis if licensing is desired, and much less installation time and configuration time is required because the application is located on one central machine. The Spice Intranet Package (SIP) is demonstrated as an example of such a networked CAD application. This particular application allows users to run Spice simulations and view graphical analysis of electronic circuits through a network connection using a Web browser. The SIP application has many options that include simulation and analysis of Spice files, graphical analysis of data, online editing of Spice files, passwords with separate file areas for each user, and a user friendly graphical user interface
Keywords :
Internet; SPICE; circuit CAD; circuit analysis computing; graphical user interfaces; software packages; Spice Intranet Package; Spice simulations; Web browser; computer network communications; computer-aided design; electronic circuits; graphical analysis; networked CAD tools; online editing; operating system; pay-per-use basis; user friendly graphical user interface; Analytical models; Application software; Circuit analysis; Circuit simulation; Computer networks; Design automation; Electronics packaging; Licenses; Operating systems; Packaging machines;
Conference_Titel :
Industrial Electronics, 1998. Proceedings. ISIE '98. IEEE International Symposium on
Conference_Location :
Pretoria
Print_ISBN :
0-7803-4756-0
DOI :
10.1109/ISIE.1998.707775