DocumentCode
3271321
Title
A Novel Method for the Fabrication of Photonic Crystal Fiber
Author
Guiyao, Zhou ; Lantian, Hou ; Zhiyun, Hou ; Shuguang, Li
Author_Institution
Key Lab. of Metastable Mater. Sci. & Technol., Yanshan Univ.
Volume
3
fYear
2006
fDate
25-28 June 2006
Firstpage
1958
Lastpage
1960
Abstract
This paper describes a novel method of fabrication for glass photonic crystal fibres (GPCF) with die-cast process. The die is made of the heat-resisting alloy steel, whose inner structure matches the GPCF´s structure, and the SF6 glass is used as the material of GPCF. The die is vertically put in the vessel with SF6 glass, and the vacuum hose is attached to the top of the die, then put them in the furnace to heat at 870 K together. The die is slowly filled with the softening glass under vacuum condition till it is full. Keep it in the furnace to anneal at a rate of 20 K/h to remove thermal stress that could lead to cracks. The outer tube of the die is taken apart after its temperature is close to room temperature, and the fused glass bundle is etched in an acidic solution to remove the heat-resisting alloy steel rods, and the etched bundle is ready for use as a GPCF preform. The preform is thinned to a fibre. The GPCF is observed the generation of supercontinuum, with the flat plateau in the spectrum of output emission stretching from 400 to 1400 nm by experimental measurement. The transmission loss is 0.2-0.3 dB/m at the wavelength of 420-900 nm
Keywords
alloy steel; annealing; die casting; optical fibre fabrication; optical fibre losses; optical fibre testing; optical glass; photonic crystals; supercontinuum generation; thermal stress cracking; 400 to 1400 nm; 870 K; GPCF preform; SF6 glass; annealing; cracks; die-cast process; fused glass bundle; glass photonic crystal fiber fabrication; heat-resisting alloy steel rods; softening glass; supercontinuum generation; thermal stress; transmission loss; Etching; Fabrication; Furnaces; Glass; Iron alloys; Photonic crystal fibers; Steel; Sulfur hexafluoride; Temperature; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Communications, Circuits and Systems Proceedings, 2006 International Conference on
Conference_Location
Guilin
Print_ISBN
0-7803-9584-0
Electronic_ISBN
0-7803-9585-9
Type
conf
DOI
10.1109/ICCCAS.2006.285057
Filename
4064283
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