DocumentCode
3271444
Title
Predicting EMC emissions from printed circuit boards using numerical modeling tools
Author
Archambeault, Bruce
Author_Institution
IBM, Research Triange Park, NC, USA
fYear
1999
fDate
1999
Firstpage
361
Lastpage
364
Abstract
Most signals which cause emissions originate on the printed circuit (PC) board. Naturally, some of these signals are required for proper operation of the device, but often these required signals are coupled into areas where they were not intended and cause potential EMC emissions. Typical PC boards contain many traces which are closely packed together. This makes the analysis of potential emissions very complex and difficult. There is a need for automated prediction tools which divide the total PC board emissions problem into individual problems which can be analyzed quickly and accurately. While there is not one modeling tool which can predict emissions from a complete circuit board CAD file, there are many applications for modeling of emissions from PC boards. Each specific cause must be considered separately, and then modeled individually. This is likely to require a number of different modeling tools and techniques. This analysis is likely to require the finite-difference time-domain (FDTD), the method of moments (MoM) and the partial element equivalent circuit (PEEC) modeling techniques, at different times, for different applications
Keywords
electromagnetic compatibility; electromagnetic interference; equivalent circuits; finite difference time-domain analysis; method of moments; printed circuits; EMC emissions prediction; FDTD; automated prediction tools; circuit board CAD file; finite-difference time-domain; method of moments; numerical modeling tools; partial element equivalent circuit modeling; printed circuit boards; Clocks; Coupling circuits; Electromagnetic compatibility; Maxwell equations; Numerical models; Numerical simulation; Predictive models; Printed circuits; Resonance; Runtime;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 1999 International Symposium on
Conference_Location
Tokyo
Print_ISBN
4-9980748-4-9
Type
conf
DOI
10.1109/ELMAGC.1999.801339
Filename
801339
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