Ground bouncing analysis using a program linking FDTD and SPICE

Author

Nishizawa, Akinori ; Shimazaki, Mutsumi ; Tanabe, Shinji

Author_Institution

Adv. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo, Japan

fYear

1999

fDate

1999

Firstpage

381

Lastpage

384

Abstract

Ground bouncing noise was analyzed by a link program of finite difference time domain (FDTD) and SPICE. In this program, the electric characteristics of buffer ICs is computed by SPICE, whereas the distributed parameter of a printed circuit board (PCB) and electromagnetic (EM) wave radiation to the open air are computed by FDTD. Typical bouncing voltage and current waveforms can be obtained by this program. The computed results agree with the measurement results

Keywords

SPICE; buffer circuits; circuit analysis computing; electromagnetic interference; finite difference time-domain analysis; integrated circuits; printed circuits; EM wave radiation; FDTD; PCB; SPICE; bouncing current waveform; bouncing voltage waveform; buffer IC; distributed parameter; electric characteristics; electromagnetic wave radiation; finite difference time domain; ground bouncing analysis; printed circuit board; Circuit noise; Distributed computing; Electric variables; Electromagnetic radiation; Electromagnetic scattering; Finite difference methods; Joining processes; Printed circuits; SPICE; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 1999 International Symposium on

Conference_Location

Tokyo

Print_ISBN

4-9980748-4-9

Type

conf

DOI

10.1109/ELMAGC.1999.801344

Filename

801344