Title :
Ground bouncing analysis using a program linking FDTD and SPICE
Author :
Nishizawa, Akinori ; Shimazaki, Mutsumi ; Tanabe, Shinji
Author_Institution :
Adv. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo, Japan
Abstract :
Ground bouncing noise was analyzed by a link program of finite difference time domain (FDTD) and SPICE. In this program, the electric characteristics of buffer ICs is computed by SPICE, whereas the distributed parameter of a printed circuit board (PCB) and electromagnetic (EM) wave radiation to the open air are computed by FDTD. Typical bouncing voltage and current waveforms can be obtained by this program. The computed results agree with the measurement results
Keywords :
SPICE; buffer circuits; circuit analysis computing; electromagnetic interference; finite difference time-domain analysis; integrated circuits; printed circuits; EM wave radiation; FDTD; PCB; SPICE; bouncing current waveform; bouncing voltage waveform; buffer IC; distributed parameter; electric characteristics; electromagnetic wave radiation; finite difference time domain; ground bouncing analysis; printed circuit board; Circuit noise; Distributed computing; Electric variables; Electromagnetic radiation; Electromagnetic scattering; Finite difference methods; Joining processes; Printed circuits; SPICE; Time domain analysis;
Conference_Titel :
Electromagnetic Compatibility, 1999 International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
4-9980748-4-9
DOI :
10.1109/ELMAGC.1999.801344
