Title :
A new approach to making thin film head/slider devices
Author_Institution :
IBM Corporation
Keywords :
Magnetic films; Magnetic heads; Magnetic recording; Rails; Sputter etching; Substrates; Thin film devices; Transistors; Wafer bonding; Wet etching;
Conference_Titel :
Magnetics Conference, 1989. Digests of INTERMAG '89., International
Conference_Location :
Washington, DC, USA
DOI :
10.1109/INTMAG.1989.690128
