• DocumentCode
    3271601
  • Title

    Ferrite powders for chip inductor device

  • Author

    Nakamura, T. ; Okano, Y. ; Sugita, N. ; Hatakeyama, K.

  • Author_Institution
    R&D Div., Toda Kogyo Corp., Hiroshima, Japan
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    393
  • Lastpage
    396
  • Abstract
    The interfacial diffusion between ferrite and Ag during co-firing was investigated using the SEM-EDX technique. It was found that the diffusion increases with the sintering temperature. Some impurities promote the interfacial diffusion. We proposed ferrite powders suitable for the chip inductor devices
  • Keywords
    X-ray chemical analysis; copper compounds; diffusion; ferrites; inductors; magnetic particles; nickel compounds; scanning electron microscopy; sintering; surface mount technology; zinc compounds; 4 h; 870 to 950 C; Ag; Ni0.2Zn0.6Cu0.2Fe2O 4; Ni0.2Zn0.6Cu0.2Fe2O 4-Ag -Ni0.2Zn0.6Cu0.2Fe2O4 ; SEM-EDX technique; chip inductor device; co-firing; ferrite powders; impurities; interfacial diffusion; sintering temperature; surface mounting device; Electrodes; Ferrites; Frequency; Impurities; Inductors; Magnetic materials; Powders; Production; Temperature; Zinc oxide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 1999 International Symposium on
  • Conference_Location
    Tokyo
  • Print_ISBN
    4-9980748-4-9
  • Type

    conf

  • DOI
    10.1109/ELMAGC.1999.801347
  • Filename
    801347
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3271601