DocumentCode :
3271936
Title :
Thermal Conductivity Measurement about Fluid and Solid
Author :
Liu Yinghui
Author_Institution :
Hunan Univ. of Technol., Zhuzhou, China
fYear :
2013
fDate :
16-18 Jan. 2013
Firstpage :
1570
Lastpage :
1573
Abstract :
In the paper, transient hot wire method was presented to test thermal conductivity of the fluid and solid. The superiority of transient hot wire method was introduced. The parallel-plate instrument and heat flow-meter instrument have faster, more accurate and efficient measurement of the thermal conductivity of materials.
Keywords :
thermal conductivity; thermal conductivity measurement; heat flow-meter instrument; parallel-plate instrument; thermal conductivity measurement; transient hot wire method; Conductivity; Heating; Instruments; Solids; Temperature measurement; Thermal conductivity; Data treatment; Heat flow-meter instrument; Thermal conductivity; Transient hot wire method;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Intelligent System Design and Engineering Applications (ISDEA), 2013 Third International Conference on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4673-4893-5
Type :
conf
DOI :
10.1109/ISDEA.2012.377
Filename :
6455228
Link To Document :
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