Electrodeposition of organic dielectric and its application to MEMS devices

Author

Sakata, Tomomi ; Ishii, Hiromu ; Okabe, Yuichi ; Sato, Norio ; Kudou, Kazuhisa ; Machida, Katsuyuki

Author_Institution

NTT Microsyst. Integration Labs., Atsugi, Japan

fYear

2005

fDate

25-28 Oct. 2005

Firstpage

276

Lastpage

277

Abstract

We developed a method for the uniform electrodeposition of organic dielectric on gold electrodes after the release process in MEMS device fabrication. The method involves dipping in HClaq and HClaq as pre-treatment and an optimized annealing temperature as post-treatment. The method proved its effectiveness on the gold comb-shaped electrodes in vibrational MEMS devices.

Keywords

annealing; dielectric thin films; electrodeposition; electrodes; gold; micromechanical devices; organic compounds; MEMS device; annealing temperature; comb-shaped electrode; electrodeposition; gold electrode; organic dielectric; Actuators; Annealing; Coatings; Dielectric devices; Electrodes; Gold; Microelectromechanical devices; Plasma applications; Plasma devices; Shape;

fLanguage

English

Publisher

ieee

Conference_Titel

Microprocesses and Nanotechnology Conference, 2005 International

Print_ISBN

4-9902472-2-1

Type

conf

DOI

10.1109/IMNC.2005.203845

Filename

1595321

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3272023