DocumentCode
3272325
Title
Stack assembly technology research
Author
Yu, Cao Xin ; Zhen, Yang Hong
Author_Institution
Electron. Eng. Dept., North China Inst. of Aerosp. Eng., Langfang, China
fYear
2011
fDate
15-17 April 2011
Firstpage
4483
Lastpage
4486
Abstract
This paper analyzes the impact of stack assembly process quality, through a large number of experiments and scientific analysis obtained the corresponding solution. The technology is simpler, easy-to-use, flexible, and controllable. This technology can make use of the existing SMT equipment, can lower production costs and improve production efficiency and yield.
Keywords
assembling; costing; quality management; stacking; system-in-package; 3D package; SMT equipment; production cost; production efficiency; production yield; stack assembly process quality; stack assembly technology; Aerospace engineering; Awards activities; Conferences; Electronic components; Packaging; Production; Stacking; 3d package; SMT; Stack;
fLanguage
English
Publisher
ieee
Conference_Titel
Electric Information and Control Engineering (ICEICE), 2011 International Conference on
Conference_Location
Wuhan
Print_ISBN
978-1-4244-8036-4
Type
conf
DOI
10.1109/ICEICE.2011.5777209
Filename
5777209
Link To Document