DocumentCode
3272336
Title
Applications of the Taguchi method for optimized package design
Author
Tai-Yu Chou
Author_Institution
Express Packaging Syst. Inc., Palo Alto, CA
fYear
1996
fDate
28-30 Oct 1996
Firstpage
14
Lastpage
17
Abstract
A robust technique for noise and sensitivity analysis for packages in the system environment using the design of experiment (DOE) and orthogonal matrix array is presented. The use of DOE allows full factorial parametric analysis and the use of an orthogonal array significantly reduces the number of simulations. The results of noise and sensitivity analysis can be used to predict the noise and sensitivity of system performance to random package physical design parameter variations, to identify the most noise sensitive parameters and to quantify the effects. System performance predictions and sensitivity analysis can be used to compare the performance of different packages, to determine the performance limits of the package and system, and to optimize system and package design. The reliability of this approach is verified by case studies
Keywords
design of experiments; noise; packaging; sensitivity analysis; Taguchi Method; design of experiment; noise analysis; optimized package design; orthogonal matrix array; parametric analysis; sensitivity analysis; system performance predictions;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location
Napa, CA
Print_ISBN
0-7803-3514-7
Type
conf
DOI
10.1109/EPEP.1996.564762
Filename
564762
Link To Document