Title :
Modeling of lead-frame plastic CSPs for accurate prediction of their low-pass filter effects on RFICs
Author :
Horng, T.S. ; Wu, S.M. ; Huang, H.H. ; Chiu, C.T. ; Hung, C.P.
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Abstract :
This paper presents a direct extraction method to construct the electrical models of lead-frame plastic CSPs (Chip Scale Packages) for RFICs from the measured S-parameters. To evaluate the package effects on the reciprocal passive components, the insertion loss for an on-chip 50-ohm microstrip line housed in a 32-pin BCC (Bump Chip Carrier) package was calculated based on the established package model. Excellent agreement with measurement has been found up to 15 GHz. When applied to the non-reciprocal active components, the variation of gain for an HBT (Heterojunction Bipolar Transistor) array housed in an 8-pin BCC package has been also predicted up to 22 GHz successfully. Both cases have demonstrated that the package acts as a low-pass filter to cause a sharp cut off for the RFIC components above a certain frequency.
Keywords :
MMIC; S-parameters; UHF integrated circuits; chip scale packaging; equivalent circuits; integrated circuit modelling; low-pass filters; plastic packaging; 22 GHz; 32-pin package; 8-pin package; BCC package; HBT array; RFIC components; RFICs; bump chip carrier package; chip scale packages; direct extraction method; electrical models; heterojunction bipolar transistor array; insertion loss; lead-frame plastic CSPs; low-pass filter effects; measured S-parameters; nonreciprocal active components; onchip microstrip line; package effects; package model; reciprocal passive components; Chip scale packaging; Electric variables measurement; Heterojunction bipolar transistors; Insertion loss; Microstrip components; Plastic packaging; Predictive models; Radiofrequency integrated circuits; Scattering parameters; Semiconductor device measurement;
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 2001. Digest of Papers. 2001 IEEE
Conference_Location :
Phoenix, AZ, USA
Print_ISBN :
0-7803-6601-8
DOI :
10.1109/RFIC.2001.935659