DocumentCode :
3272527
Title :
Trade-off analyses in system designs and some implications to manufacturing
Author :
Arabi, T. ; Riendeau, D. ; Tripp, M.
Author_Institution :
Sort/Test Technol. Dev., Intel Corp., Hillsboro, OR
fYear :
1996
fDate :
28-30 Oct 1996
Firstpage :
18
Lastpage :
20
Abstract :
Microprocessor speeds continue to double with every silicon generation. Consequently, the design and test margins continue to decrease very rapidly. With these decreasing margins, errors in the design and design validation phases of high-speed systems can cause direct yield hits at the desired frequency of operation. It is shown in this paper that estimating the system performance and carrying out the trade-off analyses based on the absolute worst case design/test are overly restrictive and can be misleading
Keywords :
digital circuits; failure analysis; packaging; printed circuit design; statistical analysis; absolute worst case design/test; design validation; high speed systems; manufacturing; system design; system performance estimation; test margins; tradeoff analyses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
Type :
conf
DOI :
10.1109/EPEP.1996.564763
Filename :
564763
Link To Document :
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