The influence of extruded-finned heatsink on noise susceptibility of IC; the case of capacitive coupling

Author

Nonaka, Junpei ; Nitta, Shuichi ; Mutoh, Atsuo ; Miyashita, Takuya

Author_Institution

Fac. of Eng., Tokyo Univ. of Agric. & Technol., Japan

fYear

1999

fDate

1999

Firstpage

612

Lastpage

615

Abstract

This study describes the simulated and experimental results about the influence of an extruded-finned heatsink on the noise susceptibility of an IC. It is concluded that the simulated results by FEM and authors´ proposed approximation method to reduce computation time are in good agreement with the experimental results within 2 dB, and the noise susceptibility of the IC increases (immunity degrades) by equipping a heatsink, except susceptibility is down in the resonant frequency of the circuits

Keywords

circuit simulation; electromagnetic coupling; electromagnetic interference; finite element analysis; heat sinks; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; FEM; IC; approximation method; capacitive coupling; computation time; extruded-finned heatsink; integrated circuit; noise susceptibility; resonant frequency; susceptibility; Approximation methods; Computer aided software engineering; Conductors; Electromagnetic heating; Integrated circuit noise; Noise reduction; Noise shaping; Resistance heating; Space heating; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 1999 International Symposium on

Conference_Location

Tokyo

Print_ISBN

4-9980748-4-9

Type

conf

DOI

10.1109/ELMAGC.1999.801402

Filename

801402