• DocumentCode
    3272543
  • Title

    Evaluation of 32-Bit carry-look-ahead adder circuit with hybrid tunneling FET and FinFET devices

  • Author

    Tse-Ching Wu ; Chien-Ju Chen ; Yin-Nien Chen ; Hu, Vita Pi-Ho ; Pin Su ; Ching-Te Chuang

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2015
  • fDate
    1-3 June 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, we investigate the hybrid TFET-FinFET 32-bit carry-look-ahead adder (CLA) circuit and compare the delay, power and power-delay product (PDP) with all FinFET and all TFET implementations in near-threshold region. We use atomistic 3D TCAD mixed-mode simulations for transistor characteristics and HSPICE circuit simulations with look-up table based Verilog-A models calibrated with TCAD simulation results. In the hybrid design, TFETs are used for the top critical path to reduce the longest path delay, and FinFETs are used for the rest of the circuit to reduce switching power and leakage power. The PDP of the hybrid TFET-FinFET CLA circuit is better than the circuits with all FinFET and all TFET implementations in the vicinity of VDD=0.3V. However, as the operating voltage is further reduced, the lower-ranked critical paths (e.g. 2nd critical path) with some FinFET devices in the path stick out, and the delay and PDP become inferior to all TFET implementation.
  • Keywords
    MOSFET circuits; adders; circuit simulation; logic design; technology CAD (electronics); FinFET devices; FinFET implementation; HSPICE circuit simulations; TCAD simulation results; TFET implementation; atomistic 3D TCAD mixed-mode simulations; carry-look-ahead adder circuit; hybrid TFET-FinFET CLA circuit; hybrid tunneling FET; leakage power; look-up table based Verilog-A models; near-threshold region; power-delay product; switching power; transistor characteristics; voltage 0.3 V; word length 32 bit; Capacitance; Delays; FinFETs; Hardware design languages; Hybrid power systems; Integrated circuit modeling; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IC Design & Technology (ICICDT), 2015 International Conference on
  • Conference_Location
    Leuven
  • Type

    conf

  • DOI
    10.1109/ICICDT.2015.7165880
  • Filename
    7165880