Title :
Alpha chip packaging challenges of today and tomorrow
Author :
Adam, John D. ; Brown, Kenneth
Author_Institution :
Digital Equipment Corp., Hudson, MA
Abstract :
Summary form only given, as follows. Several generations of Alpha microprocessors have been designed and delivered which have provided industry leading performance. Chip and packaging design for Alpha have worked collaboratively to allow optimization across both spaces to ship at the highest chip performance and lowest packaging cost. The authors review the packaging design methods and technologies developed to meet the cost, performance, and time-to-market goals for a 60 watt, 500 MHz microprocessor utilizing a wirebond, ceramic PGA
Keywords :
digital integrated circuits; integrated circuit packaging; microprocessor chips; 500 MHz; 60 W; Alpha chip packaging; Alpha microprocessors; digital ICs; packaging design methods; packaging technologies; pin grid array; support chips; wirebond ceramic PGA;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564764
