DocumentCode :
3272846
Title :
Off-state stress degradation mechanism on advanced p-MOSFETs
Author :
Moonju Cho ; Spessot, Alessio ; Kaczer, Ben ; Aoulaiche, Marc ; Ritzenthaler, Romain ; Schram, Tom ; Fazan, Pierre ; Horiguchi, Naoto ; Linten, Dimitri
Author_Institution :
Imec, Leuven, Belgium
fYear :
2015
fDate :
1-3 June 2015
Firstpage :
1
Lastpage :
4
Abstract :
Deep insights into the Off-State Stress (OSS) degradation mechanism on p-MOSFETs with High-K/Metal Gate technology are presented in this paper. Large subthreshold slope degradation, or positive Vth shift is observed in high, or low Vth devices, where both phenomena impact the off current degradation. The OSS degradation mechanism in pMOS is generated by (1) hot carrier generation close to the drain junction by impact ionization, then (2) hot electron injection into the oxide bulk defects, and (3) Si/oxide interface degradation. Both TCAD simulations and measurement with VGate-to-Drain modulation demonstrate the mechanism. The Vth shift in OSS is toward an opposite direction compared to CHC or BTI, which suggest a means to restore the Vth to the initial value after the OSS degradation.
Keywords :
MOSFET; hot carriers; impact ionisation; technology CAD (electronics); OSS degradation mechanism; Si/oxide interface degradation; TCAD simulations; advanced p-MOSFET; drain junction; high-K/metal gate technology; hot carrier generation; hot electron injection; impact ionization; off current degradation; off-state stress degradation mechanism; oxide bulk defects; Degradation; Hafnium compounds; Hot carriers; Logic gates; Silicon; Stress; Tin; MOSFETs; Off State Stress; Semiconductor device reliability; high-k metal-gate;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IC Design & Technology (ICICDT), 2015 International Conference on
Conference_Location :
Leuven
Type :
conf
DOI :
10.1109/ICICDT.2015.7165893
Filename :
7165893
Link To Document :
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