DocumentCode
3272926
Title
Aggregate modeling of semiconductor equipment using effective process times
Author
Etman, L.F.P. ; Veeger, C.P.L. ; Lefeber, E. ; Adan, I.J.B.F. ; Rooda, J.E.
Author_Institution
Dept. of Mech. Eng., Eindhoven Univ. of Technol., Eindhoven, Netherlands
fYear
2011
fDate
11-14 Dec. 2011
Firstpage
1790
Lastpage
1802
Abstract
Performance evaluation using queueing models is common practice in semiconductor manufacturing. Analytical closed-form expressions and simulation models are popular in capacity planning and the analysis of equipment configurations. However, the complexity of semiconductor processes complicates the modeling of the equipment. Analytical models lack the required accuracy, whereas simulation models require too many details, making them impractical. Aggregation is a way to overcome this difficulty. The various details are not modeled in detail, but their contribution is lumped in the aggregate model, which makes the model more appropriate for both analysis and simulation. This paper gives an overview of our efforts to develop a top-down aggregate modeling approach for semiconductor equipment, starting from the effective process time concept inspired by the Factory Physics book of Hopp and Spearman. The strong feature of our modeling approach is that the aggregate model parameters are estimated directly from industrial data (arrival and departure times), without the need to quantify the various details.
Keywords
capacity planning (manufacturing); modelling; queueing theory; semiconductor device manufacture; analytical closed form expression model; capacity planning; industrial data; parameter estimation; performance evaluation; queueing model; semiconductor equipment configuration; semiconductor manufacturing; simulation model; top-down aggregate modeling; Aggregates; Analytical models; Computational modeling; Mathematical model; Semiconductor device modeling; Semiconductor process modeling; Workstations;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation Conference (WSC), Proceedings of the 2011 Winter
Conference_Location
Phoenix, AZ
ISSN
0891-7736
Print_ISBN
978-1-4577-2108-3
Electronic_ISBN
0891-7736
Type
conf
DOI
10.1109/WSC.2011.6147894
Filename
6147894
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