Title :
Power distribution fidelity of wirebond compared to flip chip devices in grid array packages
Author :
Hashemi, Hossein ; Herrell, D.
Author_Institution :
Adv. Micro Devices Inc., Austin, TX
Abstract :
We have simulated the power fidelity of wirebond and flip chip grid array packages suitable for next generation microprocessors. The DC power droop across the chip from resistive losses and the AC power noise from switching events were studied as a function of the number of package power planes, dielectric constant, the number of chip connections, decoupling capacitors and their location
Keywords :
flip-chip devices; integrated circuit packaging; integrated circuit reliability; lead bonding; microprocessor chips; plastic packaging; AC power noise; DC power droop; chip connections; decoupling capacitors; dielectric constant; flip chip devices; grid array packages; next generation microprocessors; package power planes; power distribution fidelity; resistive losses; wirebond;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564765
