DocumentCode
3273143
Title
Application of tool science techniques to improve tool efficiency for a dry etch cluster tool
Author
Havey, Robert ; Wang, Lixin ; Kim, DongJin
Author_Institution
Micron Technol. Inc., Manassas, VA, USA
fYear
2011
fDate
11-14 Dec. 2011
Firstpage
1921
Lastpage
1926
Abstract
Semiconductor manufacturing is a capital-intensive industry. How to utilize billions of dollars of equipment as efficiently as possible is a critical factor for a semiconductor manufacturer to succeed in stiff competition. Unlike operations management techniques, like planning and scheduling, which are proven to improve tool performance by controlling WIP (work-in-process) movement, tool science techniques focus on tool architecture, components and operations inside the tool. In this paper, we first studied process time behavior of a cluster tool and fixed inefficient process sequence. A Petri Net model was then created to determine the internal bottleneck component of the tool. Results indicated that tool science techniques helped improve tool efficiency and resulted in significant cost savings.
Keywords
Petri nets; etching; production equipment; production planning; scheduling; semiconductor device manufacture; semiconductor industry; work in progress; Petri net model; WIP; capital-intensive industry; dry etch cluster tool; operations management techniques; planning; scheduling; semiconductor manufacturer; semiconductor manufacturing; tool efficiency; tool science techniques; work-in-process; Analytical models; Asynchronous transfer mode; Image color analysis; Job shop scheduling; Robots; Semiconductor device modeling; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation Conference (WSC), Proceedings of the 2011 Winter
Conference_Location
Phoenix, AZ
ISSN
0891-7736
Print_ISBN
978-1-4577-2108-3
Electronic_ISBN
0891-7736
Type
conf
DOI
10.1109/WSC.2011.6147906
Filename
6147906
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