• DocumentCode
    3273168
  • Title

    Simulating conveyor-based amhs layout configurations in small wafer lot manufacturing environments

  • Author

    Miller, Leanna ; Bradley, Alger ; Tish, Ashley ; Jin, Tongdan ; Jimenez, Jesus A. ; Wright, Robert

  • Author_Institution
    Ingram Sch. of Eng., Texas State Univ. - San Marcos, San Marcos, TX, USA
  • fYear
    2011
  • fDate
    11-14 Dec. 2011
  • Firstpage
    1939
  • Lastpage
    1947
  • Abstract
    Automated material handling systems (AMHS) using conveyors have been recently proposed as a technology option for next generation wafer fabrication facilities. This technology seems to provide an increasing capacity for moving and storing wafers in a continuous flow transport environment. The goal of this research is to design and test conveyor-based AMHS configurations, which include turntables and storage areas near the processing equipment. Simulation models were developed in AutoMod to determine the best conveyor layout, with emphasis in comparing centralized versus distributed storage systems. The AMHS factors under study comprise the number, location, and capacity of the storage areas. Simulation results show that the distributed storage approach provides improved performance; however, these systems require more capital investment than that needed for the centralized storage approach.
  • Keywords
    conveyors; integrated circuit manufacture; production facilities; storage; AutoMod; automated material handling systems; capital investment; centralized storage approach; conveyor-based AMHS layout configurations; distributed storage systems; next generation wafer fabrication facilities; wafer lot manufacturing environments; Analytical models; Buffer storage; Layout; Manufacturing; Semiconductor device modeling; Throughput; Tracking;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference (WSC), Proceedings of the 2011 Winter
  • Conference_Location
    Phoenix, AZ
  • ISSN
    0891-7736
  • Print_ISBN
    978-1-4577-2108-3
  • Electronic_ISBN
    0891-7736
  • Type

    conf

  • DOI
    10.1109/WSC.2011.6147908
  • Filename
    6147908