Title :
Wetting interaction between Pb-free Sn-Zn series solders and Cu, Ag substrates
Author :
Lin, Kwang Lung ; Liu, Pei Chi ; Song, Jenn Ming
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Abstract :
This study investigated the wetting behavior of Cu and Ag with pure Sn and several Sn-Zn solders, including Sn-9Zn (abbreviated as Sn-Zn), Sn-8.55Zn-0.5Al (abbreviated as Sn-Al), and Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga (abbreviated as Sn-Zn-Ag-Al-Ga). Results show that Sn-Zn solders exhibit better wettability with both Cu and Ag than pure Sn. The primary interfacial intermetallics in Sn-Zn are (Ag,Cu)Zn rather than (Ag,Cu)Sn. By way of alloying modification, the Sn-Zn-Ag-Al-Ga alloy exhibits a greater wetting behavior than other solders.
Keywords :
aluminium alloys; copper; gallium alloys; silver; solders; tin; tin alloys; wetting; zinc alloys; Ag-Sn; Cu-Sn; SnZn-Ag; SnZn-Cu; SnZnAgAlGa-Ag; SnZnAgAlGa-Cu; SnZnAl-Ag; SnZnAl-Cu; lead free solders; primary interfacial intermetallics; solder/substrate wetting interaction; wettability; Artificial intelligence; Force measurement; Intermetallic; Morphology; Probes; Scanning electron microscopy; Temperature; Time measurement; Tin; Wires;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1320282
