DocumentCode
3273740
Title
Study of intermetallic growth on PWBs soldered with Sn3.0Ag0.5Cu
Author
Lee, Minhung ; Hwang ; Pecht, M. ; Park, J. ; Kim, Y. ; Liu, Wenxin
Author_Institution
CALCE EPSC, Maryland Univ., College Park, MD, USA
Volume
2
fYear
2004
fDate
1-4 June 2004
Firstpage
1338
Abstract
This paper describes the formation of intermetallic compounds at the interface and in the bulk of Sn3.0Ag0.5Cu reflow soldered on FR-4 PWBs. One plating system is organic solderability preservative (OSP) over bare copper and the other is immersion gold over electroless nickel (Au/Ni). The paper discusses the growth of these intermetallic phases after soldering, and after aging at 100 and 1000 hours at a homologous temperature of 0.85Tm. In order to clarify the reliability of the bond between lead free solder (Sn3.0Ag0.5Cu) and copper pad, the mechanical properties such as shear strength, hardness, and elastic modulus of the intermetallics formed at the interface on printed wiring board was also investigated.
Keywords
ageing; circuit reliability; copper; copper alloys; elastic moduli; gold; hardness; nickel; printed circuits; reflow soldering; shear strength; silver alloys; solders; tin alloys; 100 hour; 1000 hour; 143.5 degC; FR-4 PWB; OSP; PWB intermetallic growth; SnAgCu-Au-Ni; SnAgCu-Cu; aging; bond reliability; elastic modulus; hardness; homologous temperature; immersion gold over electroless nickel; intermetallic phases; lead free solder; organic solderability preservative; plating system; reflow soldering; shear strength; Aging; Bonding; Copper; Environmentally friendly manufacturing techniques; Gold; Intermetallic; Nickel; Soldering; Temperature; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN
0-7803-8365-6
Type
conf
DOI
10.1109/ECTC.2004.1320286
Filename
1320286
Link To Document