Title :
Mirror coating and packaging for a horizontal MEMS optical switch array
Author :
Li, M. ; Chung, P.S. ; Yeung, M.T. ; Chan, P.S. ; Liang, T.K. ; Shu, C. ; Lai, K.W.C. ; Li, W.J. ; Tong, F. ; Tsang, H.K.
Author_Institution :
Photonic Packaging Lab., Chinese Univ. of Hong Kong, China
Abstract :
A prototype package for a microelectromechanical system (MEMS) optical ON-OFF switch array has been designed, fabricated and assembled. The package consists of a horizontal surface micromachined 3D PolyMUMPs mirror chip, optical fibers and a micro-bench which acts as a carrier for the MEMS chip and optical fiber assemblies. The packaging alignment was achieved using an auto-alignment system. A multi-layer dielectric optical coating has also been designed and applied to enhance the optical performance of the mirrors. The packaged MEMS optical switch has been characterized.
Keywords :
electro-optical switches; electronics packaging; micromachining; micromirrors; optical fibres; optical films; 3D PolyMUMP mirror; Au-Si; ON-OFF switch; horizontal MEMS optical switch array; horizontal surface micromachined mirror chip; mirror coating; multilayer dielectric optical coating; optical fibers; optical micro-bench; optical switch array packaging; packaging auto-alignment system; Coatings; Microelectromechanical systems; Micromechanical devices; Mirrors; Optical arrays; Optical design; Optical fibers; Optical switches; Packaging; Prototypes;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1320295
