DocumentCode
3274338
Title
Self Aligned Trap-Shallow Trench Isolation Scheme for the Reliability of TANOS (TaN/AlO/SiN/Oxide/Si) NAND Flash Memory
Author
Sim, Jae Sung ; Park, Jintaek ; Kang, Changseok ; Jung, Wonseok ; Shin, Yoocheol ; Kim, Juhyung ; Sel, Jongsun ; Lee, ChangHyun ; Jeon, Sanghun ; Jeong, Younseok ; Park, Youngwoo ; Choi, Jungdal ; Lee, Won-Seong
Author_Institution
Samsung Electron. Co., Ltd., Yongin
fYear
2007
fDate
26-30 Aug. 2007
Firstpage
110
Lastpage
111
Abstract
In the proposed new scheme, which is named self aligned trap-shallow trench isolation (SAT-STI), such process damage on high-k layer can be minimized, achieving the goal of isolating the storage nitride layer successfully.
Keywords
aluminium compounds; flash memories; isolation technology; semiconductor device reliability; silicon compounds; tantalum compounds; NAND flash memory; TaN-Al2O3-Si3N4-SiO2-Si; self aligned trap-shallow trench isolation; storage nitride layer isolation; Aluminum oxide; Dielectrics; Electrodes; Electron traps; Electronic mail; Etching; Material storage; Research and development; Semiconductor device reliability; Silicon compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Non-Volatile Semiconductor Memory Workshop, 2007 22nd IEEE
Conference_Location
Monterey, CA
Print_ISBN
1-4244-0753-2
Electronic_ISBN
1-4244-0753-2
Type
conf
DOI
10.1109/NVSMW.2007.4290602
Filename
4290602
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