Title :
Thermal-fatigue life prediction equation for wafer-level chip scale package (WLCSP) lead-free solder joints on lead-free printed circuit board (PCB)
Author :
Lau, John H. ; Shangguan, Dongkai ; Lau, D.C.Y. ; Kung, Terry T W ; Lee, S. W Ricky
Author_Institution :
Agilent Technol. Inc., Santa Clara, CA, USA
Abstract :
A new thermal-fatigue life prediction equation for a class of lead-free solder alloys, 95.5wt%Sn3.9-4.0wt%Ag0.5-0.6wt%Cu is proposed in this investigation. The test vehicle consists of a lead-free solder-bumped WLCSP, lead-free PCB, and lead-free solder paste. The coefficients of the fatigue equation presented herein are determined by best fitted with the isothermal fatigue data of the test vehicle. Failure modes and locations of the failed samples are discussed.
Keywords :
chip scale packaging; copper alloys; fatigue testing; flip-chip devices; integrated circuit reliability; reflow soldering; silver alloys; solders; thermal stress cracking; tin alloys; SnAgCu; failure locations; failure modes; flip-chip solder joints; isothermal fatigue; lead-free printed circuit board; lead-free solder joints; reflow temperature profile; solder paste printing; thermal-fatigue life prediction equation; wafer-level chip scale package; Chip scale packaging; Circuit testing; Environmentally friendly manufacturing techniques; Equations; Fatigue; Lead; Printed circuits; Soldering; Vehicles; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1320324
