Title :
A novel highly heat-resistant substrate material for halogen-free applications
Author :
Hirota, Kousuke ; Shima, Kenji ; Iiyama, Takashi
Author_Institution :
Mitsui Chemicals Inc., Chiba, Japan
Abstract :
A novel halogen-free laminate for IC package substrate has been developed, based on molecular-level designing of polymer networks. Utilization of high-LOI (limiting oxygen index) resin constituents contributes to enhance flame resistance of the resin itself and to lower the content of metal hydrate as flame retardant. In this paper, we compared the properties of halogen-free laminates, especially those which influence significantly on the package reliability. The newly developed halogen-free laminate "BN300GF" has its glass transition temperature over 300°C and shows superior resistance against beat and chemical treatment.
Keywords :
filled polymers; flame retardants; flammability; integrated circuit packaging; integrated circuit reliability; laminates; life testing; substrates; thermal management (packaging); IC package substrate; accelerated test; chemical resistance; chemical stability; flame resistance; glass transition temperature; halogen-free laminate; highly heat-resistant substrate materia; humidity stress test; limiting oxygen index resin constituents; metal hydrate flame retardant; molecular-level design; package reliability; polymer networks; temperature test; Chemical compounds; Fires; Immune system; Integrated circuit packaging; Laminates; Polymers; Resins; Resistance heating; Temperature; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1320332
