Abstract :
Conference proceedings front matter may contain various advertisements, welcome messages, committee or program information, and other miscellaneous conference information. This may in some cases also include the cover art, table of contents, copyright statements, title-page or half title-pages, blank pages, venue maps or other general information relating to the conference that was part of the original conference proceedings.
Keywords :
integrated circuit modelling; integrated circuit technology; integrated memory circuits; micromechanical devices; monolithic integrated circuits; power electronics; reliability; semiconductor device models; semiconductor devices; semiconductor technology; sensors; vacuum microelectronics; CMOS device reliability; DRAM technology; HBTs; HEMTs; MESFETs; RF power devices; SOI; SRAM technology; compact modelling; detectors; dielectric technology; high-speed CMOS; hot carrier effects; image sensors; interconnect technology; lasers; microelectromechanical devices; nonvolatile memory technology; quantum devices; smartpower devices; solid state devices; vacuum microelectronics;
