• DocumentCode
    3274867
  • Title

    A New Reduced Bulk Field (REBULF) High-Voltage LDMOS with N+-Floating Layer

  • Author

    Duan, Baoxing ; Zhang, Bo ; Li, Zhaoji

  • Author_Institution
    Res. Inst. of Micro-Electron., Univ. of Electron. Sci. & Technol. of China, Chengdu
  • Volume
    4
  • fYear
    2006
  • fDate
    25-28 June 2006
  • Firstpage
    2709
  • Lastpage
    2712
  • Abstract
    A novel concept of REBULF (REduced BULk Field) is proposed for the development of smart power integrated circuit with thin epitaxy layer, and a new device structure of Reduced BULk Field LDMOS with N+-floating layer embedded in the high-resistance substrate is designed. The mechanism of improved breakdown characteristics is that the high electric field around the drain is reduced by N+-floating layer which causes the redistribution of the bulk electric field in the drift region, and the substrate supports more biases. The critical condition of REBULF is analyzed and validated by 2-D MEDICI simulator, which is the product of the location of N+ -floating layer and substrate´s doping isn´t more than 1X1012cm-2, and the breakdown voltage of REBULF LDMOS is increased by 75% in comparison to RESURF LDMOS.
  • Keywords
    MOS integrated circuits; power integrated circuits; semiconductor device breakdown; semiconductor device models; semiconductor doping; semiconductor epitaxial layers; 2-D MEDICI simulator; LDMOSFET; N+-floating layer; REBULF; breakdown voltage; doping; drift region; epitaxy layer; high-resistance substrate; reduced bulk field high-voltage LDMOS design; smart power integrated circuit; Avalanche breakdown; Breakdown voltage; Electric breakdown; Epitaxial growth; Immune system; Medical simulation; Power integrated circuits; Silicon; Substrates; Surface resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications, Circuits and Systems Proceedings, 2006 International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    0-7803-9584-0
  • Electronic_ISBN
    0-7803-9585-9
  • Type

    conf

  • DOI
    10.1109/ICCCAS.2006.285229
  • Filename
    4064476