DocumentCode :
3274981
Title :
Development of a curriculum in nano and MEMS packaging and manufacturing for integrated systems to prepare next generation workforce
Author :
Malshe, Ajay P.
Author_Institution :
Dept. of Mech. Eng., Arkansas Univ., Fayetteville, AR, USA
Volume :
2
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
1706
Abstract :
In this narrative author has described background of nano and MEMS and related Microsystems packaging and manufacturing revolution and thus evolved educational framework that is essential to create desired workforce. This technology and market driven revolution is at the stem of new economy and demands training of skilled workforce to harbor and progress realization of novel and advanced products. The highlighted findings and examples are based upon author´s experience in the related research and education for the past eight years at the University of Arkansas, where there is a major attention in building a nano and micro packaging and manufacturing program.
Keywords :
educational courses; electronic engineering education; industrial training; integrated circuit packaging; micromechanical devices; nanoelectronics; semiconductor device packaging; MEMS manufacturing; MEMS packaging; curriculum development; demands training; educational framework; market driven revolution; nano manufacturing; nano packaging; next generation workforce; skilled workforce; subject multilingual workforce; technology driven revolution; Biomedical optical imaging; Consumer electronics; Educational products; Electronics packaging; Guidelines; Integrated optics; Logic programming; Manufacturing; Micromechanical devices; Optical devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
Type :
conf
DOI :
10.1109/ECTC.2004.1320347
Filename :
1320347
Link To Document :
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