DocumentCode :
3275011
Title :
Multi-level education curriculum of electronic manufacturing engineering in GUET
Author :
Yang, Dong Gyu ; Sun, N. ; Ma, X.S.
Author_Institution :
Dept. of Mech. Eng., Guilin Univ. of Electron. Technol., China
Volume :
2
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
1716
Abstract :
Electronics manufacturing has become a significant sector in manufacturing industry. The fast developing electronics industry challenges the conventional university education. How to adjust the education curriculum to provide qualified engineers for the electronics industry is a challenging task for a university of electronic technology. This paper summarizes the experience in the field of electronics manufacturing engineering education in Guilin University of Electronic Technology, China. In the Department of Mechanical Engineering, multi-level education curriculum in the field of electronics manufacturing engineering has been established through more than one decade effort. Specialized courses in electronics assembly and packaging are provided for the undergraduates in the traditional specializations such as Mechanical Design, Manufacturing and Automation. For the MS graduate students, education in this field is realized through the specialized courses and packaging and assembly-related thesis research projects. Many students found a job in the big electronics companies, mostly benefiting from the courses provided in the university. A new specialization of B.S program in the name of "Microelectronics Manufacturing Engineering" has been set up within the department. The university becomes the first and the only university so far in China to setup such a specialization.
Keywords :
continuing education; educational courses; educational institutions; electronic engineering education; electronics industry; electronics packaging; further education; industrial engineering; China university; Guilin University of Electronic Technology; continuing education; conventional university education; electronic manufacturing engineering; electronics assembly; electronics industry challenges; electronics packaging; graduate level; microelectronics manufacturing engineering; multilevel education curriculum; undergraduate level; Assembly; Design automation; Educational technology; Electronics industry; Electronics packaging; Engineering education; Industrial electronics; Manufacturing automation; Mechanical engineering; Pulp manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
Type :
conf
DOI :
10.1109/ECTC.2004.1320349
Filename :
1320349
Link To Document :
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