DocumentCode :
3275218
Title :
Impediments to impedance and coupled noise: characteristic impedance design and coupled noise control on flexible circuits
Author :
Doyle, Matthew S.
Author_Institution :
IBM Corp., Rochester, MN, USA
Volume :
2
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
1788
Abstract :
Signal integrity analysis is largely neglected in flexible circuit design. Referred to as "cables," ribbons or discrete connections, minimal, if any, analysis is typically performed. However, due to their ability to successfully address mechanical flexibility and cost constraints, flexible circuits have become increasingly appealing solutions for high-speed, controlled impedance interconnect. Design for signal integrity, characteristic impedance and attenuation control are critical to successfully placing flexible circuits in the highspeed market at GHz frequencies. This paper addresses the following: (1) mesh reference plane impedance prediction using solid plane techniques; (2) characteristic impedance variations caused by inconsistent orientation to reference planes; (3) uneven adhesive distribution in mesh reference constructs; (4) cross-talk resulting from signal-to-mesh orientation and dielectric separation; (5) material alternatives to lower dielectric loss in high-speed applications.
Keywords :
adhesive bonding; circuit noise; coupled circuits; crosstalk; dielectric materials; electric impedance; interconnections; network synthesis; printed circuit design; adhesive distribution; attenuation control; characteristic impedance design; coupled noise control; cross-talk; dielectric loss reduction; dielectric separation; flexible circuits; high-speed controlled impedance interconnect; low loss dielectric materials; mechanical flexibility; mesh reference plane impedance prediction; reference plane orientation; signal integrity analysis; signal-to-mesh orientation; solid plane techniques; Cables; Circuit analysis; Circuit noise; Circuit synthesis; Coupling circuits; Crosstalk; Dielectric losses; Flexible printed circuits; Impedance; Signal analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
Type :
conf
DOI :
10.1109/ECTC.2004.1320361
Filename :
1320361
Link To Document :
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