• DocumentCode
    3275218
  • Title

    Impediments to impedance and coupled noise: characteristic impedance design and coupled noise control on flexible circuits

  • Author

    Doyle, Matthew S.

  • Author_Institution
    IBM Corp., Rochester, MN, USA
  • Volume
    2
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    1788
  • Abstract
    Signal integrity analysis is largely neglected in flexible circuit design. Referred to as "cables," ribbons or discrete connections, minimal, if any, analysis is typically performed. However, due to their ability to successfully address mechanical flexibility and cost constraints, flexible circuits have become increasingly appealing solutions for high-speed, controlled impedance interconnect. Design for signal integrity, characteristic impedance and attenuation control are critical to successfully placing flexible circuits in the highspeed market at GHz frequencies. This paper addresses the following: (1) mesh reference plane impedance prediction using solid plane techniques; (2) characteristic impedance variations caused by inconsistent orientation to reference planes; (3) uneven adhesive distribution in mesh reference constructs; (4) cross-talk resulting from signal-to-mesh orientation and dielectric separation; (5) material alternatives to lower dielectric loss in high-speed applications.
  • Keywords
    adhesive bonding; circuit noise; coupled circuits; crosstalk; dielectric materials; electric impedance; interconnections; network synthesis; printed circuit design; adhesive distribution; attenuation control; characteristic impedance design; coupled noise control; cross-talk; dielectric loss reduction; dielectric separation; flexible circuits; high-speed controlled impedance interconnect; low loss dielectric materials; mechanical flexibility; mesh reference plane impedance prediction; reference plane orientation; signal integrity analysis; signal-to-mesh orientation; solid plane techniques; Cables; Circuit analysis; Circuit noise; Circuit synthesis; Coupling circuits; Crosstalk; Dielectric losses; Flexible printed circuits; Impedance; Signal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2004. Proceedings. 54th
  • Print_ISBN
    0-7803-8365-6
  • Type

    conf

  • DOI
    10.1109/ECTC.2004.1320361
  • Filename
    1320361