DocumentCode :
3275316
Title :
Design of multiband baluns on liquid crystalline polymer (LCP) based substrates
Author :
Govind, Vinu ; Dalmia, Sidharth ; Sundaram, Venky ; White, George E. ; Swaminathan, Madhavan
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., USA
Volume :
2
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
1812
Abstract :
Baluns operating at multiple frequency bands can result in a reduction in the size of multiband RF front-ends. This paper presents novel multiband balun topologies, using both distributed as well as lumped components. Using LCP packaging technology, baluns operating simultaneously at the 930 and 2000 MHz frequency bands have been fabricated. Measurements show -14.5 dB and -32.4 dB return loss in the lower and upper bands. The phase and amplitude imbalances are less than 2.5° and 0.6 dB in each band.
Keywords :
UHF circuits; baluns; electronics packaging; liquid crystal polymers; plastic packaging; 14.5 dB; 2000 MHz; 32.4 dB; 930 MHz; LCP based substrates; LCP packaging technology; distributed components; liquid crystalline polymer; lumped components; multiband RF front-ends; multiband baluns; multiple frequency band baluns; Crystallization; Energy consumption; Impedance matching; Liquid crystal polymers; Packaging; Power transmission lines; Protocols; Radio frequency; Stacking; Topology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
Type :
conf
DOI :
10.1109/ECTC.2004.1320365
Filename :
1320365
Link To Document :
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