A leadless packaging concept for high frequency applications

We present a low cost leadless packaging concept for applications in the GHz region. This package concept has an ultra-miniaturized footprint, small dimensions of the contact pads, and a standard package height of 0.4 mm. Further reduction of the package height is possible. The semiconductor chip can be implemented in a wire bond or a flip chip version. We demonstrate the capability of this package concept by three different applications in the GHz region. First, we show the performance of a filter component, designed to suppress the 3^rd harmonic in a GSM application. This example represents a wire bond version of the package concept. The other two demonstrators are high frequency bipolar transistors and frequency dividers working up to 30 GHz, respectively. They are based upon flip chip interconnects. The results show that the package concept using the flip chip version is not yet limited at frequencies of 30 GHz.