DocumentCode :
3275535
Title :
Wafer-level integration of on-chip antennas and RF passives using high-resistivity polysilicon substrate technology
Author :
Mendes, P.M. ; Sinaga, S. ; Polyakov, A. ; Bartek, M. ; Burghartz, J.N. ; Correia, J.H.
Author_Institution :
Lab. of ECTM/DIMES, Delft Univ. of Technol., Netherlands
Volume :
2
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
1879
Abstract :
High-resistivity polycrystalline silicon (HRPS) wafers are utilized as low-loss substrates for three-dimensional integration of on-chip antennas and RF passive components (e.g. large inductors) in wafer-level chip-scale packages (WLCSP). Sandwiching of HRPS and silicon wafers enables to integrate large RF passives with a spacing of >150 μm to the conductive silicon substrate containing the circuitry, while providing mechanical stability, reducing form factor and avoiding any additional RF loss. Antenna performance comparable to glass substrates and high quality factors for large spiral inductors (Q=11 at 1 GHz; 34 nH) are demonstrated. The HRPS substrates have high dielectric constant, low RF loss, high thermal conductivity, perfect thermal matching, and processing similar to single-crystalline silicon.
Keywords :
Q-factor; UHF antennas; chip scale packaging; electrical resistivity; elemental semiconductors; losses; mechanical stability; mobile antennas; permittivity; radio equipment; silicon; substrates; thermal conductivity; thin film inductors; 1 GHz; 150 micron; 3D integration; HRPS wafers; RF inductors; RF loss; RF passives; Si; WLCSP; antenna performance; conductive silicon substrate; dielectric constant; form factor; glass substrates; high-resistivity polysilicon substrate technology; low-loss substrates; mechanical stability; on-chip antennas; quality factors; silicon wafers; spiral inductors; thermal conductivity; thermal matching; wafer-level chip-scale packages; wafer-level integration; Antenna accessories; Chip scale packaging; Circuit stability; Dielectric substrates; Glass; Inductors; Radio frequency; Silicon; Thermal conductivity; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
Type :
conf
DOI :
10.1109/ECTC.2004.1320376
Filename :
1320376
Link To Document :
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