DocumentCode :
3275640
Title :
Laser diode package-level performance optimization based on far field distribution
Author :
Soskind, Y. ; Perkins, J. ; Wall, T.
Author_Institution :
JDS Uniphase Corp., Ewing, NJ, USA
Volume :
2
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
1909
Abstract :
The modal field distribution from a semiconductor laser diode (LD) is a critical input parameter required for the optical design and performance analysis of transceiver modules. Information regarding the near field (NF) distribution is not always available from the LD manufacturer. However, far field (FF) angular distribution scans can be readily performed and effectively used to optimize the package-level performance of semiconductor lasers. We present a reconstruction of a LD FF angular distribution based on a set of experimental FF distribution scans performed in orthogonal directions. The reconstructed FF distribution is used in the optical design and packaging performance optimization of a semiconductor laser. We establish an Equivalent Far Field Gaussian (EFFG) definition of the LD FF angular distribution data, used as an analytical representation of the more complex LD FF angular distribution, simplifying performance analysis and optimization. The results obtained using EFFG, as well as with some other commonly used Gaussian beam approximations of the LD FF angular distribution are also presented and discussed.
Keywords :
Gaussian distribution; modules; optical communication equipment; semiconductor device packaging; semiconductor lasers; transceivers; angular scans; critical input parameter; equivalent far field Gaussian definition; far field distribution; laser beam ellipticity; modal field distribution; optical design; optimum magnification; package-level performance optimization; semiconductor laser diode; transceiver modules; Diode lasers; Laser beams; Noise measurement; Optical design; Optimization; Performance analysis; Semiconductor device manufacture; Semiconductor device packaging; Semiconductor lasers; Transceivers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
Type :
conf
DOI :
10.1109/ECTC.2004.1320382
Filename :
1320382
Link To Document :
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