Title :
Photolithography of 3D topology in Si optical bench for self-aligned placement of laser dies
Author :
Li, M. ; Tsang, H.K. ; Shu, C. ; Wei, C.C. ; Law, C.W. ; Lau, Y.K. ; Kwok, R.W.M. ; Hu, X.W. ; Zhu, H.L.
Author_Institution :
Shipley Asia Technol. Center, Shipley Asia Ltd., Hong Kong, China
Abstract :
The purpose of the investigation is to develop a prototype hybrid package to integrate an InGaAsP laser diode array with an array of waveguides on the Si optical bench (SiOB) using solder-bumped flip chip technology.
Keywords :
III-V semiconductors; flip-chip devices; gallium arsenide; indium compounds; optical fabrication; optical planar waveguides; photolithography; reflow soldering; semiconductor device packaging; semiconductor laser arrays; silicon-on-insulator; sputter etching; 3D topology; InGaAsP; SOI wafer; active laser; alignment accuracy; deep etching; laser dies; laser diode array; low cost optoelectronic packaging; passive self-aligned hybrid integration; photolithography; prototype hybrid package; self-aligned placement; silicon optical bench; solder volume variation; solder-bumped flip chip technology; waveguides array; Diode lasers; Integrated optics; Lithography; Optical arrays; Optical waveguides; Packaging; Prototypes; Semiconductor laser arrays; Topology; Waveguide lasers;
Conference_Titel :
Electronic Components and Technology Conference, 2004. Proceedings. 54th
Print_ISBN :
0-7803-8365-6
DOI :
10.1109/ECTC.2004.1320385
