DocumentCode :
3275754
Title :
Validation of Autodesk Ecotect™ accuracy for thermal and daylighting simulations
Author :
Vangimalla, Prasanthi R. ; Olbina, Svetlana J. ; Issa, Raymond R. ; Hinze, Jimmie
Author_Institution :
Univ. of Florida, Gainesville, FL, USA
fYear :
2011
fDate :
11-14 Dec. 2011
Firstpage :
3383
Lastpage :
3394
Abstract :
Autodesk Ecotect™ is an environmental analysis software which according to the U.S. Department of Energy, has not been validated yet. Therefore, the objectives of this research were to validate accuracy of Ecotect™ for thermal and daylighting simulations of buildings and provide recommendations to the Architecture, Engineering and Construction community on application of Ecotect™. Analysis of thermal performance of an institutional building was conducted for one year while the daylighting performance was studied from January to September. The thermal loads and illuminance levels of the building were first measured in the field. The field measurements were then compared to the simulated thermal loads and illuminance levels obtained by Ecotect™. The validation results showed that Ecotect™ underestimated thermal loads in all the analyzed cases and overestimated illuminance levels in 98% of the analyzed cases. Therefore, these findings show that Ecotect™ cannot be used for accurate simulations of thermal loads and illuminance levels.
Keywords :
building management systems; civil engineering computing; daylighting; energy conservation; environmental factors; U.S. Department of Energy; architecture community; autodesk Ecotect validation; building daylighting simulations; construction community; environmental analysis software; institutional building; thermal simulations; Buildings; Cooling; Daylighting; Heating; Solid modeling; Thermal loading;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation Conference (WSC), Proceedings of the 2011 Winter
Conference_Location :
Phoenix, AZ
ISSN :
0891-7736
Print_ISBN :
978-1-4577-2108-3
Electronic_ISBN :
0891-7736
Type :
conf
DOI :
10.1109/WSC.2011.6148034
Filename :
6148034
Link To Document :
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