• DocumentCode
    3275754
  • Title

    Validation of Autodesk Ecotect™ accuracy for thermal and daylighting simulations

  • Author

    Vangimalla, Prasanthi R. ; Olbina, Svetlana J. ; Issa, Raymond R. ; Hinze, Jimmie

  • Author_Institution
    Univ. of Florida, Gainesville, FL, USA
  • fYear
    2011
  • fDate
    11-14 Dec. 2011
  • Firstpage
    3383
  • Lastpage
    3394
  • Abstract
    Autodesk Ecotect™ is an environmental analysis software which according to the U.S. Department of Energy, has not been validated yet. Therefore, the objectives of this research were to validate accuracy of Ecotect™ for thermal and daylighting simulations of buildings and provide recommendations to the Architecture, Engineering and Construction community on application of Ecotect™. Analysis of thermal performance of an institutional building was conducted for one year while the daylighting performance was studied from January to September. The thermal loads and illuminance levels of the building were first measured in the field. The field measurements were then compared to the simulated thermal loads and illuminance levels obtained by Ecotect™. The validation results showed that Ecotect™ underestimated thermal loads in all the analyzed cases and overestimated illuminance levels in 98% of the analyzed cases. Therefore, these findings show that Ecotect™ cannot be used for accurate simulations of thermal loads and illuminance levels.
  • Keywords
    building management systems; civil engineering computing; daylighting; energy conservation; environmental factors; U.S. Department of Energy; architecture community; autodesk Ecotect validation; building daylighting simulations; construction community; environmental analysis software; institutional building; thermal simulations; Buildings; Cooling; Daylighting; Heating; Solid modeling; Thermal loading;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference (WSC), Proceedings of the 2011 Winter
  • Conference_Location
    Phoenix, AZ
  • ISSN
    0891-7736
  • Print_ISBN
    978-1-4577-2108-3
  • Electronic_ISBN
    0891-7736
  • Type

    conf

  • DOI
    10.1109/WSC.2011.6148034
  • Filename
    6148034