High manufacturability and thermal stability mini-flat transmitter for 10Gb/s Ethernet applications

In this paper, the authors have demonstrated a low cost, highly manufacturable and thermally stable mini-transmitter for 10 Gb/s Ethernet applications. A novel two lens semi-passive alignment structure of 10 Gb/s 1310 nm SC receptacle or pigtail type optical mini-flat transmitter are designed and demonstrated to exhibit about 35% coupling efficiency with a ±5 μm accuracy flip chip bonder general silicon optical bench process (SiOB) and packaging flow. Moreover, a high resistivity SiOB (1kΩ/cm) and pressure-free bonding technique, using electroplated gold-tin solder, are also adopted to guarantee the transmitted performance in high speed operation. The eye diagram of the transmitter shows an excellent quality, passing the 10 Gb/s Ethernet mask test with 30% margin. The extinction ratio of the transmitter is also proved to above 6 dB at room temperature. The optical eye diagram shows excellent eye quality, passing the 10 Gb/s Ethernet mask test from 0°C to 80°C. Finally, the reliability of the transmitter is also evaluated in this paper.