Physics-based reliability assessment of embedded passives

The integration of passives into boards requires research in process steps, material synthesis and characterization, thermomechanical-electrical modeling, fabrication and reliability testing. The literature available on the thermo-mechanical reliability of integral passives and its relation to system level reliability is limited. The reliability of integral passives under thermal excursions through physics-based models is presented in this paper. The thermo-mechanical failure mechanisms and their influence on system electrical parameters (R, L and C parameters) are discussed.